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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6534 Issued Date : 1998.06.01 Revised Date : 2002.02.18 Page No. : 1/4 HSD1616A NPN EPITAXIAL PLANAR TRANSISTOR Description The HSD1616A is designed for audio frequency power amplifier and medium speed switching applications. Absolute Maximum Ratings TO-92 * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ...................................................................................... 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 750 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ....................................................................................... 120 V VCEO Collector to Emitter Voltage ...................................................................................... 60 V VEBO Emitter to Base Voltage .............................................................................................. 6 V IC Collector Current (DC) ...................................................................................................... 1 A IC Collector Current *(Pulse) ................................................................................................. 2 A Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) VBE(on) *hFE1 *hFE2 fT Cob ton ts tf Min. 120 60 6 600 135 81 100 Typ. 150 0.9 160 0.07 0.95 0.07 Max. 100 100 300 1.2 700 600 19 Unit V V V nA nA mV V mV Test Conditions IC=100uA IC=1mA IE=10uA VCB=60V VEB=6V IC=1A, IB=50mA IC=1A, IB=50mA VCE=2V, IC=50mA VCE=2V, IC=100mA VCE=2V, IC=1A VCE=2V, IC=100mA IE=0, VCB=10V, f=1MHz VCE=10V, IC=100mA IB1=-IB2=10mA VBE(off)=-2~-3V *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz pF uS uS uS Classification of hFE1 Rank Range Y 135-270 G 200-400 L 300-600 HSD1616A HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 Spec. No. : HE6534 Issued Date : 1998.06.01 Revised Date : 2002.02.18 Page No. : 2/4 Saturation Voltage & Collector Current 1000 125 C o Saturation Voltage (mV) 100 125 C o hFE 100 25 C o 75 C o 25 C 10 o 75 C o hFE @ VCE=2V VCE(sat) @ IC=20IB 10 1 10 100 1000 10000 1 1 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 25 C o ON Voltage & Collector Current 1000 25 C o Saturation Voltage (mV) ON Voltage (mV) 75 C 125 C o o 75 C 125 C o o VBE(sat) @ IC=20IB VBE(ON) @ VCE=2V 100 1 10 100 1000 10000 100 1 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Capacitance & Reverse-Biased Voltage 100 1000 Cutoff Frequency & Collector Current Cutoff Frequency (MHz).. . Capacitance (Pf) Cob fT @ VCE=2V 100 10 0.1 1 10 100 10 1 10 100 1000 Reverse Biased Voltage (V) Collector Current (mA) HSD1616A HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6534 Issued Date : 1998.06.01 Revised Date : 2002.02.18 Page No. : 3/4 Safe Operating Area 10000 PT=1ms Power Derating 800 700 Collector Current (mA) 1000 PT=1s Power Dissipation-PD (mW) PT=100ms 600 500 400 300 200 100 100 10 1 1 10 100 0 0 50 100 o 150 200 Forward Voltage (V) Ambient Temperature-Ta ( C) HSD1616A HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6534 Issued Date : 1998.06.01 Revised Date : 2002.02.18 Page No. : 4/4 2 Marking: H SD 1616A Rank Control Code 3 C Style: Pin 1.Emitter 2.Collector 3.Base D H I E F G 1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HSD1616A HSMC Product Specification |
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